Cov txheej txheem ceramic metallization yog ib qho tseem ceeb ntawm kev tsim khoom siv hluav taws xob niaj hnub. Nws koom nrog daim ntawv thov txheej txheej hlau conductive mus rau hauv ceramic substrate, ua kom muaj kev sib koom ua ke ntawm cov khoom siv hluav taws xob. Hauv cov txheej txheem no, peb cov ntsiab lus tseem ceeb tshwm sim: DBC (Direct Bonded Copper), DPC (Direct Plated Copper), thiab AMB (Alumina Metallization Barrier). Txhua tus ua lub luag haujlwm sib txawv hauv kev ua kom muaj kev ua haujlwm thiab kev ntseeg siab ntawm cov khoom siv hluav taws xob.
Direct Bonded tooj liab (DBC)
Direct Bonded Copper, lossis DBC, yog cov txheej txheem tseem ceeb rau cov txheej txheem ceramic metallization. Nws koom nrog kev sib xyaw ntawm tooj liab mus rau hauv cov txheej txheem ceramic los ntawm cov txheej txheem kub-kub sib txuas. Qhov no ua rau muaj zog thiab ua tau zoo heev ntawm cov hlau thiab cov ceramic.
Cov txheej txheem DBC pib nrog kev npaj ntawm ob qho tib si ceramic substrate thiab txheej tooj liab. Cov ceramic feem ntau yog tsim los ntawm cov ntaub ntawv xws li alumina (Al2O3) paub txog lawv cov thermal thiab hluav taws xob rwb thaiv tsev zoo heev. Copper txheej, ntawm qhov tod tes, yog meticulously ntxuav thiab feem ntau roughened los txhim kho adhesion.
Cov txheej txheem kev sib raug zoo tshwm sim nyob rau hauv ib puag ncig tswj, qhov twg cov ceramic thiab tooj liab raug cua sov thiab siab heev. Qhov no ua rau cov tooj liab zoo sib xyaw nrog cov nplais ceramic, tsim kom muaj kev hloov pauv ntawm ob cov ntaub ntawv. Qhov tshwm sim DBC qauv muab lub platform zoo tagnrho rau mounting cov khoom siv hluav taws xob, xws li semiconductors, diodes, thiab cov khoom siv fais fab.
Qhov zoo ntawm DBC yog manifold. Nws cov thermal conductivity siab tso cai rau kom muaj txiaj ntsig zoo ntawm cov cua sov tsim tawm thaum lub sijhawm ua haujlwm, tseem ceeb heev rau kev siv hauv hluav taws xob hluav taws xob. Tsis tas li ntawd, kev sib raug zoo ntawm cov tooj liab thiab ceramic txo qis thermal expansion mismatches, txo qhov kev pheej hmoo ntawm kev ua haujlwm tsis zoo. DBC thev naus laus zis tau siv dav hauv ntau qhov kev lag luam, suav nrog tsheb, hluav taws xob txuas ntxiv, thiab aerospace, qhov chaw muaj kev ntseeg siab thiab ua tau zoo hauv hluav taws xob yog qhov tseem ceeb.
Direct Plated tooj liab (DPC)
Direct Plated Copper, lossis DPC, yog lwm txoj hauv kev hauv cov txheej txheem ceramic metallization. Tsis zoo li DBC, uas cuam tshuam nrog kev sib xyaw ntawm tooj liab mus rau cov txheej txheem ceramic, DPC ntiav cov txheej txheem tso nyiaj. Nyob rau hauv cov txheej txheem no, ib txheej nyias ntawm tooj liab yog electroplated ncaj qha mus rau lub ceramic nto.
Cov txheej txheem DPC pib nrog kev tsim cov txheej txheej txheej txheej ntawm cov txheej txheem ceramic. Cov txheej no ua lub hauv paus rau cov txheej txheem electroplating tom ntej. Los ntawm kev tswj cov tshuaj electrochemical, tooj liab ions tau muab tso rau hauv cov noob txheej, maj mam tsim cov txheej txheem sib txuas.
DPC muaj qhov zoo sib xws hauv qee daim ntawv thov. Nws tso cai rau kev tswj xyuas meej ntawm cov tuab ntawm txheej tooj liab, ua kom muaj kev hloov kho kom haum rau cov qauv tsim tshwj xeeb. Tsis tas li ntawd, cov txheej txheem electroplating tuaj yeem raug kho kom ua tiav cov yam ntxwv zoo thiab cov qauv sib txawv, ua rau DPC haum rau cov ntawv thov uas xav tau kev sib cuam tshuam loj.
Alumina Metallization Barrier (AMB)
Nyob rau hauv cov ntsiab lus ntawm ceramic metallization, Alumina Metallization Barrier (AMB) yog ib qho tseem ceeb tivthaiv. Nws ua hauj lwm pab raws li ib tug tiv thaiv txheej, tiv thaiv lub diffusion ntawm impurities ntawm lub ceramic substrate thiab cov hlau txheej, tshwj xeeb tshaj yog nyob rau hauv high-temperature ib puag ncig.
AMB feem ntau yog tsim los ntawm nyias zaj duab xis ntawm cov hlau refractory, xws li tungsten (W) lossis molybdenum (Mo). Cov hlau no nthuav tawm cov ntsiab lus siab melting thiab zoo heev tiv thaiv kev tawg, ua rau lawv zoo tagnrho cov neeg sib tw rau daim ntawv thov no. AMB txheej yog muab tso rau hauv ceramic nto ua ntej siv cov txheej hlau conductive.
Los ntawm kev ua raws li kev thaiv, AMB txhim khu kev ntseeg tau ntev thiab ruaj khov ntawm cov khoom siv hluav taws xob. Nws inhibits kev tsiv teb tsaws ntawm cov kab mob los yog cov ntsiab lus los ntawm ob sab ntawm lub interface, khaws cia kev ncaj ncees ntawm metallization nyob rau lub sijhawm ntev ntawm kev ua haujlwm.
Hauv kev xaus, cov txheej txheem ceramic metallization, suav nrog cov txheej txheem xws li DBC, DPC, thiab kev koom ua ke ntawm AMB, yog qhov tseem ceeb rau kev tsim khoom siv hluav taws xob niaj hnub no. Cov txheej txheem no pab tsim cov khoom siv hluav taws xob muaj zog thiab ua haujlwm siab, tseem ceeb hauv kev siv xws li hluav taws xob hluav taws xob mus rau kev sib txuas lus. Nkag siab txog cov nuances ntawm txhua tus txheej txheem yog qhov tseem ceeb rau engineers thiab manufacturers nrhiav kom optimize lawv designs thiab cov khoom rau tej kev siv thiab industries.
